ECU / VCU thermal control
Monitor a target surface, evaluate the signal in the ECU and control airflow or issue an alert.
OST sensorForcecon fanFPC
Applications
One product environment, four technical building blocks
YaoHen starts with the system requirement, then connects sensing, thermal management, precision metal and electronic interconnects where they add value.
ComputingAutomotiveRoboticsMedical & Smart Devices
Application requirements determine the right mix of sensing, cooling, metal and circuits.Computing
Notebooks, AI PCs and servers
Power density, limited space and acoustic targets create a connected sensing and cooling challenge.
Example architecture
An OST sensor monitors a surface without contact. The controller applies fan logic, and a Forcecon module removes heat within the mechanical envelope.
OST SMD sensor for surface-temperature feedback
MCU control for performance, fan curve or warning
Forcecon blower, vapor chamber and thermal module
FPC or rigid-flex routing through limited space
Mobility & Motion
Automotive, charging and robotics
Mechanical movement, continuous operation and abnormal-temperature detection shape the system.
Battery & connector monitoring
Non-contact sensing supports continuous monitoring around charging and power equipment.
Hotspot detectionAlarm logic
Compact motion systems
Flexible circuits route signals around movement while MIM parts provide compact metal structures.
Rigid-flexMIMCooling
System Flow
A closed loop around actual temperature
The same architecture can be adapted to a processor, battery, motor, power device or heated surface.
Heat source
Surface radiates infrared energy.
OST
Non-contact temperature data.
MCU / ECU
Threshold, trend or fan curve.
Forcecon
Airflow, heat spreading or liquid cooling.
Smart Devices
Medical, appliances, wearables and XR
Small packages can combine non-contact measurement, flexible circuits and detailed metal structures.
Application Matrix
Technology contribution by market
The mix changes with the product. YaoHen can support one component or coordinate several categories.
| Application | OST sensing | Forcecon thermal | Smooth MIM | FPC / PCB |
|---|---|---|---|---|
| Notebook / AI PC | Surface temperature | Blower, VC, module | Frames, mechanisms | FPC, rigid-flex, PCBA |
| AI server / data center | Hotspot monitoring | Fan, cold plate, CDU | Small structural parts | PCB and assembly support |
| Automotive / charging | Battery and power monitoring | Fan and thermal module | Durable mechanisms | FPC and PCBA |
| Robotics / industrial | Motor and surface monitoring | Compact cooling | Wear parts and structures | Motion-ready interconnects |
| Medical / smart device | Non-contact measurement | Low-profile cooling | Precision small parts | Compact circuits |
Application Review
Begin with the use case, environment and target performance
We will map the requirement to the appropriate sensing, thermal, MIM and interconnect options.