Heat source
Battery, processor, motor or surface.
Forcecon Thermal Solutions
Cooling from compact electronics to AI infrastructure
YaoHen supports Forcecon thermal components and integrated solutions, from airflow and heat spreading to direct-to-chip and immersion cooling.
FansHeat PipesVapor ChambersLiquid Cooling
Thermal Portfolio
Air, conduction and liquid cooling
Choose the heat-transfer path according to power density, thickness, airflow, acoustics and service requirements.
Air Cooling
Axial Fans
Efficient airflow for servers, networking, automotive and industrial systems.
Official product page
Directed Airflow
Centrifugal Fans
Higher-pressure airflow for notebooks and constrained electronic enclosures.
Official product page
Heat Transport
Heat Pipes
Passive transfer from a concentrated heat source to a remote dissipation area.
Official product page
Heat Spreading
Vapor Chambers
Two-dimensional heat spreading across processors and high-power devices.
Official product page
Low Profile
Slim Vapor Chambers
Heat spreading for thin notebooks, tablets and compact devices.
Official product page
Integrated Module
Server Thermal Modules
Heat sinks, fans, heat pipes and vapor chambers combined for the platform.
Official product pageLiquid Cooling
Cold Plates & CDU
Direct-to-chip heat removal for high-density servers and AI infrastructure.
Official product page
Data Center
Immersion Cooling
High heat-capture architecture for dense IT equipment and data centers.
Official product pageSelection Logic
Match the technology to the thermal constraint
A practical solution starts with heat load, available volume, ambient conditions, acoustic target and service model.
| Thermal challenge | Typical approach | Key inputs | Application examples |
|---|---|---|---|
| Compact airflow | Centrifugal fan with heat pipe or vapor chamber | Height, vent path, static pressure, dBA | Notebook, AI PC, portable device |
| Enclosure ventilation | Axial fan or fan module | CFM, pressure, voltage, IP rating | Server, networking, charging equipment |
| Concentrated hotspot | Heat pipe, vapor chamber or integrated module | Power map, contact area, orientation | CPU, GPU, power module, LED |
| High-density compute | Cold plate, manifold and CDU | Fluid, flow, pressure drop, rack design | AI server and data center |
Sensor-Controlled Cooling
Use actual surface temperature to drive the response
OST thermopile data can feed an MCU or ECU without attaching a sensor to the measured surface. The controller can adjust a fan curve, trigger an alarm or protect system performance.
OST sensor
Non-contact temperature signal.
MCU / ECU
Control threshold or fan curve.
Forcecon
Airflow or cooling-system action.
Development Flow
From requirement analysis to production
Forcecon's development model covers design, samples, validation and production introduction.
Requirement analysis
Thermal target and feasibility review.
Thermal design
Mechanical layout and CFD simulation.
Prototype
Sample build and functional verification.
Reliability
Environmental and performance validation.
Production
Stable quality and supply coordination.
Thermal Project Review
Share the power map, space, airflow and acoustic target
YaoHen will coordinate the right product path and technical questions with the Forcecon team.